abstract |
According to the present invention, there is provided an adhesive tape comprising a flux active compound having a carboxyl group and / or a phenolic hydroxyl group, a thermosetting resin and a film-forming resin. In the adhesive tape of the present invention, the thermosetting resin may be an epoxy resin, and the thermosetting resin may include a curing agent. The curing agent may be an imidazole compound and / or a phosphorus compound. The adhesive tape of this invention is used as an interlayer material of a circuit board and a multilayer flexible printed wiring board. |