| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6b4a80ac02f1ecd0e698ec665e9b36b6 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08 |
| filingDate |
2006-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17412d50a698b9afaabd12a4f351d7f7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7cbcd3ac7b9fe746d3d6a754461e78d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9d2105c7123d087021f2159b7501c86 |
| publicationDate |
2008-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20080058822-A |
| titleOfInvention |
Semiconductor die adhesive composition for electronic materials |
| abstract |
The present invention relates to a composition for semiconductor die bonding, and more particularly to an epoxy resin composition comprising a carbamic acid amide-based curing accelerator and an imidazole-based curing accelerator. The epoxy resin composition according to the present invention significantly lowers the resin bleed out phenomenon in semiconductor device packaging and exhibits improved adhesive strength. |
| priorityDate |
2006-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |