| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f7fb8e9adad52abb74b28b5975feb57a |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate |
2007-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c225c9d0a13e7cc46f88441b505adc5a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4eef7301a6b215c746b5d0c89238fb8e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a07401cf2e180f5ac16baee83d457f53 |
| publicationDate |
2008-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20080058274-A |
| titleOfInvention |
Composition for Chemical Mechanical Planarization of Copper |
| abstract |
FIELD OF THE INVENTION The present invention relates to compositions and chemical planarization methods for chemical mechanical planarization of a substrate comprising copper, which provides low defect levels for copper during the copper CMP process. The composition comprises colloidal silica substantially free of soluble polymeric silicates. |
| priorityDate |
2006-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |