| abstract |
The photosensitive resin composition which is especially useful as a buffer coat material of an LSI chip, and the resin film obtained by this photosensitive resin composition are provided. For this purpose, the photosensitive resin composition containing the polycondensate obtained by polycondensing the compound represented by a specific chemical formula in a specific mixing ratio: 100 weight part, a photoinitiator: 0.01-5 weight part, and 1-30 weight part of specific organic silanes, And the resin film obtained by apply | coating this photosensitive resin composition on a silicon wafer surface, exposing, developing, and curing. |