| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_292633037460f2a7c683a19ca8d33ddd |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
2006-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f14b7576a9208be1bcf7e3962c00fcac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7b7925689b25e4fc3696019e5380702
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d1818796c289efa3b7cae6647db32de
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e3407031bd06612262b233d0597f9ef7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c0e1fcabb877a80f485af9ff3384d66 |
| publicationDate |
2008-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20080055501-A |
| titleOfInvention |
Die Dicing Film for Stack Package Spacer |
| abstract |
The present invention relates to a die dicing film for a stack package spacer. The die dicing film for the stack package spacer of the present invention is formed of an upper layer laminated with a wafer and a lower layer formed under the upper layer and having a role of minimizing wire damage, wherein the viscosity of the upper layer is greater than that of the lower layer. It is characterized by having a laminated structure. According to the present invention, there is no wire damage in the semiconductor stack package process, and the insulation of the wires on the upper die and the lower die is made, which is suitable for use as a specification package spacer. |
| priorityDate |
2006-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |