http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20080029316-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1a492183be65153abfa7dec00d51c816
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76224
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-76
filingDate 2006-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c4b35e4d3064743ed85d44ee31ae644
publicationDate 2008-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20080029316-A
titleOfInvention Semiconductor device manufacturing method
abstract The present invention can suppress voids when forming an isolation layer of a semiconductor device, prevent degradation of cycling characteristics of the device, and can suppress the occurrence of active bending. According to the present invention, there is provided a substrate in which a tunnel oxide film, a gate forming conductive film, and a pad nitride film are sequentially stacked, and a portion of the pad nitride film, the conductive film, the tunnel oxide film, and the substrate is etched to form a trench. Forming a trench, depositing a first insulating film for device isolation on a top surface of the entire structure so that a portion of the trench is filled, and depositing a sacrificial film on the first insulating film so that the trench is completely filled; Etching the sacrificial layer and the first insulating layer to expose the pad nitride layer, and the pad nitride layer so that the aspect ratio of the trench is lowered And removing the film, removing the sacrificial film, and forming a second insulating film, which is formed of the same material as the first insulating film, to fill the trench.
priorityDate 2006-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419579069
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID411550722
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID1004

Total number of triples: 15.