http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20080025668-A

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filingDate 2006-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3bc035198e93ed7f4eca5178bbd5ce39
publicationDate 2008-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20080025668-A
titleOfInvention Resin for electromagnetic plate filling
abstract The present invention relates to providing a resin for filling an electromagnetic plate, which is unlikely to cause unfilling of the opening even when applied to a small opening. Inorganic filler (F) and curable resin (K) are included, all tan-deltas in frequencies of 1-10 Hz are 3-30, and volatile matter (133 Hz, 80 degreeC, 4 hours) is 0.2 weight% or less The resin for filling an electromagnetic plate is used. As for a viscosity (23 degreeC), 200-2000 Pa.s is preferable. It is preferable to contain 55 to 90 weight% of (F) and 10 to 45 weight% of (K) based on the weight of (F) and (K). (F) includes spherical inorganic filler F1 having a volume average particle diameter of 3 to 8 µm and nonspherical inorganic filler F2 having a volume average particle diameter of 0.1 to 3 µm, and based on the weight of (F), (F1 ) Is preferably 50 to 99% by weight, and (F2) to 1 to 50% by weight.
priorityDate 2005-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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