| abstract |
Various microfluidic devices and solid, typically electrically conductive devices are disclosed herein that can be fabricated using a mold. In certain embodiments, the devices formed include conductive paths formed by solidifying liquid metal present in one or more microfluidic channels (hereinafter, such devices are referred to as "microsolid" devices). In certain such devices, electrical connections may be formed and / or reformed between zones in the microfluidic structure; In some cases, the devices / circuits formed may be flexible and / or include flexible electrical components. In certain embodiments, the solid metal line / conductive path formed in the microfluidic channel (s) may remain contained within the microfluidic structure. In certain such embodiments, the conductive paths formed are energies (eg, electromagnetic and / or affecting fluids that the conductive paths interact with and / or flow through and / or components contained within or carried by them). Or other microfluidic channel (s) of the structure carrying the flowing fluid, so as to generate thermal energy). In other embodiments, the microsolid structure can be removed from the microfluidic mold to form a freestanding structure. In certain embodiments, the formed solid metal structure can interact with light energy incident on the structure or can be used to fabricate lightweight electrodes. Another aspect of the invention relates to the formation of self-assembled structures that may include electrically conductive paths / connections.n n n n Microfluidic devices, electrically conductive devices, microcircuits, microstructures, self-assembled structures |