| abstract |
When cutting a workpiece | work, such as a semiconductor wafer, using a laser beam, this invention suppresses cutting | disconnection of the base film itself to the minimum, prevents local adhesion of a base film to the processing table, and makes subsequent process easy An object of the present invention is to provide an adhesive sheet for laser processing that can be efficiently and efficiently performed.n n n The adhesive sheet for laser processing of this invention is an adhesive sheet for laser processing in which an adhesive layer is laminated | stacked on the surface of a base film, It is characterized by the said base film comprised by providing a melt protection layer on the back surface.n n n n Adhesive sheet for laser processing, base film, pressure-sensitive adhesive layer, melt protective layer |