http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20080012131-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67276
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-677
filingDate 2007-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6465d5c8448e582221195a83ccd350f6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_117319d9441ca022455ce9347c2ae551
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publicationDate 2008-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20080012131-A
titleOfInvention Method of evacuating intermediate conveyance chamber, substrate processing system, and intermediate conveyance chamber
abstract The subject of this invention is providing the intermediate conveyance chamber which can prevent the defect of a board | substrate. The substrate processing system 1 includes a process module 2 that performs a plasma treatment on the wafer W, an atmospheric transfer device 3 that takes out the wafer W from the hoop 5, and a wafer W. The load lock module 4 as an intermediate | middle conveyance chamber which carries in and out is provided. The load lock module 4 includes a chamber 71 having a plate-like member 90 disposed opposite the wafer mounting surface of the pick 74 of the transfer arm 70 and disposed at the same time. And a gas supply system 72 for supplying gas into the chamber 71 and an LL / M exhaust system 73 for exhausting the inside of the chamber 71.
priorityDate 2006-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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