http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20080009489-A

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filingDate 2006-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7172857242c98238f0f8839b9dcca5cc
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publicationDate 2008-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20080009489-A
titleOfInvention CPM polishing pad comprising a liquid organic core surrounded by a polymer shell and a method of manufacturing the same
abstract The present invention relates to a chemical mechanical polishing pad, and more particularly, includes a core of a polymer shell surrounding a liquid organic material having a boiling point of 130 ° C. or higher in a polymer matrix, and has pores opened by the core on a polishing surface. Provided are a CMP polishing pad and a method for producing the pad.n n n The polishing pad of the present invention has high hardness and high density, can maximize polishing efficiency and wafer flatness, and can maintain a constant core size even during urethane reaction, and thus have high polishing efficiency and stable polishing performance. The pads can be produced.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170020446-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017175894-A1
priorityDate 2006-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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