| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-38 |
| filingDate |
2007-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6af97a650b079805c670be7ecce8f940
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2933a65403084a43bccadef442df49f7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7c01740190a089b7ad29aa75c8eb310
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_298b43897096b7731d4da65c12045aa7 |
| publicationDate |
2008-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20080005126-A |
| titleOfInvention |
Electroless Copper and Redox Couple |
| abstract |
An electroless copper plating bath is disclosed. The electroless bath is formaldehyde free and environmentally friendly. The electroless bath is stable and deposits clear copper on the substrate. |
| priorityDate |
2006-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |