| abstract |
The present invention is a sheet-like underfill material affixed to a circuit surface of a semiconductor wafer 6 on which bumps 5 are formed, comprising a base material 1 and an adhesive layer 2 formed to be peelable thereon. The bump 5 penetrates through the adhesive layer 2, and the bump part is attached to the substrate 1 so as to be penetrated. The storage elastic modulus of the base material 1 is 1.0 × 10 6 to 4.0 × 10 9 kPa, the breaking stress is 1.0 × 10 5 to 2.0 × 10 8 kPa, the Young's modulus is 1.0 × 10 7 to 1.1 × 10 10 kPa, and the adhesive layer ( The storage modulus of 2) is 1.0 × 10 4 to 1.0 × 10 7 Pa, and the breaking stress is 1.0 × 10 3 to 3.0 × 10 7 Pa. |