http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20080002539-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b1007735376d07808ebe297f823b2829
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F2202-104
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-1333
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-786
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-136
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-136
filingDate 2006-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17d5e67ab73d44d6384a00337f633a67
publicationDate 2008-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20080002539-A
titleOfInvention Manufacturing method of polysilicon thin film transistor and manufacturing method of liquid crystal display device using same
abstract The present invention relates to a method of manufacturing a polysilicon thin film transistor to simplify the process by minimizing the number of times the exposure mask is used, and a method of manufacturing a liquid crystal display device using the same, in particular, a method of manufacturing a polysilicon thin film transistor is amorphous on a substrate Forming a silicon layer, forming a first self-aligned layer on a predetermined portion of the amorphous silicon layer, and forming a first metal layer on the amorphous silicon layer exposed between the first self-aligned layer And removing the first self-aligned layer, etching the amorphous silicon layer using the first metal layer as a mask, to form a semiconductor layer, and forming the amorphous silicon layer using the first metal layer as a catalyst. Crystallizing, forming source / drain electrodes on both sides of the polysilicon layer, and Characterized in that comprises a step of forming a gate insulating film on the front electrode and including a lane, the method comprising: forming a gate electrode on the gate insulating film between the source electrode and the drain electrode.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102365710-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8143670-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010117201-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010117201-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8324689-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109712933-A
priorityDate 2006-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425270609
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23968
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23963
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID412550040
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559477
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID935
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458391465
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID8157
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419405613
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425193155
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414862890
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69667
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID416641266
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID783
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23976
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23956
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23932
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458397808
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458357694

Total number of triples: 43.