http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20070122206-A

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filingDate 2006-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f0ac68d4e7ed2e7d8582069ff4288a8
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publicationDate 2007-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20070122206-A
titleOfInvention Improved Polyethylene Resin Composition with Low Melt Index and High Melt Strength
abstract Ethylene polymer compositions are disclosed that comprise high molecular weight high density polyethylene resins and low density polyethylene resins, wherein the polymer composition has a relatively high melt strength for a given melt index. The composition comprises 25 to 99% by weight of a composition of straight or substantially straight polyethylene polymer having a density of at least about 0.90 g / cc and less than about 20 I 21 ; And a melt index of less than about 5 (I 2 ), a molecular weight distribution greater than about 10, a Mw_abs / Mw_gpc ratio (“Gr”) of at least 2.7, and melt strength at 190 ° C. greater than 19.0-12.6 * log 10 (Mi). It comprises 1 to 25% by weight of the composition of the high pressure low density polyethylene resin having a. The compositions of the present invention are particularly suitable for foamed films and thermoforming applications.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160030886-A
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