| abstract |
An object of this invention is to provide the epoxy resin excellent in heat resistance, dielectric properties, water resistance, and workability, the epoxy resin composition containing this, a prepreg, and a laminated board.n n n The epoxy resin of this invention is represented by the following formula.n n n n n n n n (In formula, R represents a C1-C4 hydrocarbon group, m represents the integer of 1-4, and when m is 2-4, each R may be same or different. N is an average value 1- Represents an integer of 6)n n n Moreover, the epoxy resin composition of this invention contains the epoxy resin and hardening | curing agent of this invention. |