| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b1007735376d07808ebe297f823b2829 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2035-0827 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-136
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-786
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C35-0888 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-786
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-136 |
| filingDate |
2006-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d289ca70f5c379dcd8580531f1b1438
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db4054cc58f2ff6f96d7feca06bb5223 |
| publicationDate |
2007-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20070118873-A |
| titleOfInvention |
Manufacturing method of mold for manufacturing thin film transistor and equipment therefor |
| abstract |
The present invention relates to a method of manufacturing a mold for manufacturing a thin film transistor of the present invention and a manufacturing apparatus thereof, and there is no fear of deformation or damage of the mold and there is a fear of deformation or damage of the mold since the mold is manufactured using a photocurable material. Since it can be manufactured very thin, there is an advantage of improving the reliability of the manufacturing device and productivity through material savings. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20110129446-A |
| priorityDate |
2006-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |