| abstract |
A multi-chip module (10) and a method of manufacturing the multi-chip module. The first semiconductor chip 40 is mounted on the support substrate 12 and the second semiconductor chip 50 is mounted on the first semiconductor chip 40. The second semiconductor chip 50 has a smaller dimension 51 than the first semiconductor chip 40. The spacer is connected to the second semiconductor chip 50. Bonding pads on the first semiconductor chip 40 and the second semiconductor chip 50 are wire-bonded to the bonding pads 18, 19, 20, 21 on the support substrate 12. The third semiconductor chip 80 is mounted to the spacer 60 and the bonding pads 86 on the third semiconductor chip 80 are bonded to the bonding pads 18, 19, 20, 21 on the support substrate 12. Wire bonding. |