| abstract |
The present inventionn n n a) at least one organic stripping solvent,n n n b) fluorine ions from at least one of ammonium fluoride, ammonium bifluoride or hydrogen fluoride,n n n c) at least one acidifying agent selected from inorganic or organic acids, andn n n d) watern n n A composition for substrate process (FEOL) peeling and cleaning for cleaning an unashed ion-implanted photoresist from a wafer substrate, wherein the oxidizing agent is present, and optionally also an oxidant is present. |