http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20070113604-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0332
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
filingDate 2006-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_130ab1224f9cd61cfc316820304eab58
publicationDate 2007-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20070113604-A
titleOfInvention Method of forming fine pattern of semiconductor device
abstract The present invention is to provide a method for forming a fine pattern of a semiconductor device that can improve the non-uniformity of the line critical dimension due to two times the photo mask operation during the double exposure and etching technology (DEET) process, the present invention is Depositing a hard mask on the etched layer, forming a photoresist pattern on the hard mask, and etching the hard mask through a first etching process using the photoresist pattern as an etch mask. Forming a hard mask pattern to which the substrate is exposed, forming a sacrificial pattern spacer on both sidewalls of the hard mask pattern, removing the hard mask pattern to form a sacrificial pattern, and etching the sacrificial pattern. Forming a fine pattern by etching the etched layer through a second etching process used as a mask It provides a fine pattern formation method of a semiconductor device comprising the system.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102346368-A
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priorityDate 2006-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 26.