http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20070112778-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ee1c19da359446fb5c4f0458a57b783d http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ef81696280b2570ffaf564c1a572e5a7 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate | 2006-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_502ff0a0438d527bbf175665b5b0738b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_706940e1ad1700f4d1235915296244d6 |
| publicationDate | 2007-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20070112778-A |
| titleOfInvention | Polishing Agents for Semiconductor Integrated Circuit Devices, Polishing Methods, and Manufacturing Methods for Semiconductor Integrated Circuit Devices |
| abstract | In the manufacture of a semiconductor integrated circuit device, the pattern dependence of the polishing rate in the case of polishing the surface to be polished of the silicon dioxide-based material layer is small, and the convex portions can be preferentially polished while suppressing the polishing of the recesses, and the polishing amount is very small. This provides a technique for high leveling of the polished surface.n n n In the manufacture of a semiconductor integrated circuit device, when the surface to be polished is a surface to be polished of a silicon dioxide-based material layer, it contains a cerium oxide particle, a water-soluble polyamine, and water as an abrasive for chemical mechanical polishing for polishing the surface to be polished. An abrasive is used. |
| priorityDate | 2005-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.