| abstract |
A composition suitable for removing a low dielectric organic insulating film, a barrier film, or a composite film thereof and a substrate treating method using the same are disclosed. The composition comprising 1 to 30% by weight of the fluorine compound, 30 to 90% by weight of the organic solvent, and excess water with respect to 100% by weight in total is a low dielectric organic insulating film, barrier film or These composite films can be effectively removed without damaging the substrate. |