http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20070106129-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2707056d594790a62947ee030653e6f8 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-0026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-0016 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-14 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 |
| filingDate | 2006-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_663c24e60984cb0e2de50cbc213ffefa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb1598f957b2c44ebe013e7fd0189494 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ed9eda5204d76a26b4e9a76fffbeefe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2add04fb2e6517e34429748749718385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bd0a10e8bea76764744e3a7992e9816 |
| publicationDate | 2007-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20070106129-A |
| titleOfInvention | Manufacturing method of metal electrode |
| abstract | BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a metal electrode, comprising: (i) forming a photoresist layer on the entire surface of a substrate having insulating properties and then pre-bake, exposing, developing and post-bake D) forming a photoresist layer in addition to the portion where the metal electrode is to be formed, (ii) etching the substrate on which the pattern is formed, and (iii) dipping the etched substrate into a coupling agent solution. A process of dipping, (i) dipping the substrate dipped in the coupling agent solution again into the plating catalyst solution, and (iii) electroless metal plating of the substrate dipped in the plating catalyst solution And (i) peeling off the photoresist layer from the base material electroless metal plated.n n n According to the present invention, by forming an electrode pattern directly on a substrate using a photoresist composition having excellent heat resistance and adhesion, the high temperature treatment process is omitted while reducing a loss of metal, thereby reducing deformation of the substrate or pattern. In addition, the present invention can omit the deposition process of the plating catalyst, it is possible to form a metal electrode pattern more robust while selective plating is possible. |
| priorityDate | 2006-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 156.