| abstract |
The present invention is a heat dissipation subplate for high speed drilling in a printed circuit board when drilling, solid state consisting of nanostructured powder and high thermal conductivity compound, scratch-resistant lubricated coated composite material, support for bonding and supporting the composite material A lubricating layer provided on the surface of the material and the composite material, and characterized in that it can be grounded and lubricated when the heat generated by the blade fitted into the drill dissipates during the drilling process on the circuit board A heat dissipation subplate for drilling.n n n n Printed Circuit Boards, Drilling, Heat Dissipation, Lubrication, Synthesis |