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filingDate 2007-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_019556eb4c5bc9607d612ed9d5781ca3
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publicationDate 2007-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20070095211-A
titleOfInvention Ceramic Clad Member for Semiconductor Processing Equipment
abstract This invention aims at the improvement of durability of arrangement | positioning members in containers, such as a device for semiconductor processing in which plasma etching process is performed in a strong corrosive environment.n n n 2, which has a porous layer which consists of a thermal spray coating of the periodic table IIIa oxide on the surface of a metallic or nonmetallic base material directly or via a lower coat layer, and forms high energy, such as an electron beam or a laser beam, by irradiation process on the layer. It is a ceramic coating member in which a vehicle recrystallization layer is formed.
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priorityDate 2006-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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