| abstract |
The present invention provides an interconnect element and an interconnect element comprising a first element material and a second element material adapted to be connected to a substrate, wherein the shape of the interconnect element is modified upon deformation, including a material having deformable properties. It is about how to use. One example is a material that has deformable properties such that the volume of the first and / or second element material may undergo thermal deformation from the first volume to another volume (such as a smaller volume). |