http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20070090629-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b3310ea86f3c492f6c09d7be6592866d |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6708 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| filingDate | 2006-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a887e68a2b189886db5a30707bd20696 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d06e01fcd675dd93dbcf87146e065422 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_193221a7d6abff7a12aa80b607abc18b |
| publicationDate | 2007-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20070090629-A |
| titleOfInvention | Air injection etching system |
| abstract | The present invention relates to an etching system, and more particularly to air, characterized in that the quality of the etching process is prevented from being deteriorated by liquid pudding when the etching liquid is sequentially sprayed by a plurality of etching liquid spraying means. The present invention relates to an air injection type etching system, and provides an etching system including a plurality of air injection means which are formed before the etching liquid injection means and inject air to the left and right sides based on the traveling direction of the substrate. In the etching system in which a series of etching liquid injection means is sequentially arranged, the etching liquid sprayed again while the previously sprayed etching liquid remains in the center portion of the surface of the substrate does not directly contact the surface of the substrate. Eliminates and furthermore has a uniform etching factor over the entire surface of the substrate Circuit patterns can be implemented. Therefore, by applying the air-jet etching system of the present invention, it is possible to prevent the etching liquid immersion phenomenon appearing in the central portion of the upper surface of the substrate, and to implement a circuit pattern having a uniform etching factor. |
| priorityDate | 2006-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.