| abstract |
In the wiring board 1, a wiring stacking part 6 in which a dielectric layer and a conductor layer are stacked is formed on at least one main surface of the substrate core part 2, and the wiring stacking part 6 has a polymer material dielectric layer 3A. ), The conductor layer 4B and the ceramic dielectric layer 5 are included in this order, including a composite laminate 8 in which they are stacked in contact with each other. In the composite laminate 8, the conductor layer 4B has a conductor side cutout 18 in which part of the layer is cut in the in-plane direction, and the ceramic dielectric layer 5 is a ceramic in which part of the layer is cut in the in-plane direction. The communication cutout part 21 which has the side cutout part 16 and the ceramic side cutout part 16 and the conductor side cutout part 18 in communication with each other is formed. The polymer material constituting the polymer material dielectric layer 3A is filled in a form extending from the communication cutout 21 to the ceramic cutout 16 through the body cutout 18.n n n n Conductor side cutout, composite laminate, conductor layer, communication cutout, ceramic side cutout |