http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20070085946-A

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filingDate 2005-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d0aa19cf9903e7d40d59e024e93ea6d
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publicationDate 2007-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20070085946-A
titleOfInvention Encapsulated wafer processing apparatus and manufacturing method thereof
abstract The present invention relates to a wafer processing apparatus for use as an electrostatic chuck (ESC) comprising a graphite substrate and at least one electrode pattern in a semiconductor wafer processing apparatus, wherein the grooves of the electrode pattern are B, Al, Si, Ga, refractory hard metal. And an insulating or semiconducting material selected from the group consisting of transition metals and rare earth metals, or complexes and / or combinations thereof, and form a substantially planar surface. The substantially planar surface is then nitride, carbide, carbonitride or oxynitride of an element selected from the group consisting of B, Al, Si, Ga, refractory hard metals, transition metals and rare earth metals, or complexes thereof and / or Coated with one or more semiconductor layers comprising one or more of the combinations.
priorityDate 2004-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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