| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_069a92549123806a5d654dc036a676e9 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-681
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67778 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-677
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate |
2007-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9eb6af1e5b46d575dd12f9825b66c845
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_255c934b51375c86e59f6cc49b42fd8b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e41f3ed3b052ba1ee33d3da1dbd544a4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c497efcc8c7b75e92721191f52f2c606
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_baf129d85fbb84e5ccfc739d69cf5c41
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d48e7869bb6a46df1977c761d40ed37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cdb0a88a781c044a0afebd6dcb38ffc5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4979ecf459acf88e84f16ab731505f1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d181780dc7866eed0a2176e00c99ac46 |
| publicationDate |
2007-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20070082587-A |
| titleOfInvention |
Substrate Processing Equipment and Substrate Plating Equipment |
| abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for application of a metal such as copper (Cu) to a fine wiring pattern (concave portion) formed on a semiconductor substrate. The present invention relates to a substrate processing apparatus for loading and unloading a substrate (W). A load and unload portion, a substrate processing unit for processing the substrate W, and a transfer robot for transferring the substrate between the load and unload portion and the substrate processing unit are provided in the same facility. Is mounted, and the rotating robot is provided with a rotating table which horizontally rotates so that the substrate cassette is positioned at a position where the transfer robot can easily withdraw the substrate W from the substrate cassette. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101278711-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20230005089-A |
| priorityDate |
2000-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |