| abstract |
5 to 35% by weight of unsaturated carboxylic acid, unsaturated carboxylic anhydride or mixtures thereof, 5 to 40% by weight of styrene compounds, 5 to 40% by weight of epoxy compounds, 0.1 to 10% by weight of isobornyl compounds And a resin composition for an organic insulating film prepared by polymerizing 20 to 40 wt% of a dicyclopentadiene compound, a method of manufacturing the same, and an insulating film formed of the resin composition.n n n n Copolymer resin, organic insulating film, heat resistance, gas blowing, afterimage |