| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1ce9b692b3c1376a7c3a5db1925e5723 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-543
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-1836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02557
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02631
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0749
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-5846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-5806
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02521
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-0629
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-1872
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02562 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-06 |
| filingDate |
2005-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c0ffb6fa04e674b81df0b4451d50420 |
| publicationDate |
2007-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20070074545-A |
| titleOfInvention |
Atmospheric Pressure Chemical Vapor Deposition |
| abstract |
The method of coating a substrate at atmospheric pressure comprises vaporizing a controlled mass of semiconductor material at substantially atmospheric pressure in a heated inert gas stream to produce a fluid mixture having a temperature higher than the condensation temperature of the semiconductor material; Inducing a fluid mixture at substantially atmospheric pressure over the substrate having a temperature lower than the condensation temperature, and laminating a layer of semiconductor material over the surface of the substrate. |
| priorityDate |
2004-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |