| abstract |
A polyimide film formed of paraphenylenediamine, 4,4'-diaminodiphenyl ether and pyromellitic dianhydride was subjected to a discharge treatment, followed by a heat treatment while maintaining a constant tension in the longitudinal direction of the film. A polyimide film comprising a low heat shrinkage and high adhesive polyimide, wherein the surface free energy measured based on the contact angle method is 80 mN / m or more, and the heat shrinkage at 200 ° C. for 1 hour is 0.10% or less. film. |