patent/KR-20070069056-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20070069056-A

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9ec030fc062b270c25327af9127bed3a
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-507 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-483
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-60
filingDate	2006-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e155b562499c43b981b6c2466bdbee7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de67adaf02f7b737fc2bf6e8c855034f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ba6c71feb85356a87afe60cbc6ce370 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe5ab3d10279e3e13fff466376e05864 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3921925c8a8607b232f1eb0c71d5aa9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa9a029ff24ec3da01e7b5758dbed0fa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8eade8f8e10a26c212807793f5dee293
publicationDate	2007-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-20070069056-A
titleOfInvention	Semiconductor device and manufacturing method thereof
abstract	The present invention provides a semiconductor device having a light emitting element mounted thereon which can be easily downsized, improves luminous efficiency and can be easily formed, and a method for efficiently manufacturing the semiconductor device. The semiconductor device includes a substrate, a light emitting element mounted by flip chip bonding on the substrate, and a sealing structure sealing the phosphor film formed on the inner wall surface of the light emitting element and the sealing structure. The sealing structure includes a partition portion formed integrally with the substrate so as to surround the light emitting element on the substrate, and functioning as a reflector for reflecting light emission from the light emitting element, and a lid portion disposed on the partition portion and bonded to the partition wall portion.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101143473-B1
priorityDate	2005-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24404 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559532

Total number of triples: 30.