| abstract |
The object of this invention is to provide the ultra-thin copper foil with a carrier which does not generate | occur | produce in an interface of a peeling layer, has a low carrier peel, considers an environment, and can peel easily a carrier foil and an ultra-thin copper foil even in an environment under high temperature. And the printed wiring board which can manufacture manufacture quality of base materials, such as a printed wiring board for fine pattern uses using the said ultra-thin copper foil with a carrier stably.n n n The ultra-thin copper foil with a carrier of this invention consists of a carrier foil, a peeling layer, and an ultra-thin copper foil, The said peeling layer consists of a metal (A) which has peelability, and the metal (B) which makes plating of an ultra-thin copper foil easy, Content (a) and content (b) of metal (B) which comprise the said peeling layer aren n n 10≤a / (a + b) × 100≤70n n n It is formed to satisfy the equation. Moreover, the printed wiring board is produced using such an ultra-thin copper foil with a carrier.n n n Ultrathin copper foil with carrier, printed wiring board, high-density ultrafine wiring (fine pattern), multilayer printed wiring board, wiring board for chip on film |