| abstract |
The present invention relates to a method for the selective coating of a specific area of a composite surface with a conductive film, a method for the production of microelectronic wiring, a method and a process for the production of integrated circuits, and more particularly, a network of metal wiring It is about formation. The invention further relates to methods and processes for the manufacture of microsystems and connectors.n n n n Composite surface, conductive film, wiring, coating, graft, organic, organometallic, palladium |