| abstract |
The bump formation method which can form a some fine bump uniformly, and has high productivity is carried out by resin containing the solder powder and the convection additive 12 on the board | substrate 10 with which the some electrode 11 was formed ( After the 13 is supplied, the substrate 10 is heated to a temperature at which the solder powder is melted, while the surface of the resin 13 supplied on the substrate 10 is brought into contact with the flat plate 14. In this heating step, the molten solder powder is self-assembled, and the solder balls 15 grown by the self-assembly are collectively formed on the plurality of electrodes 11 in a self-aligned manner. After that, when the flat plate 14 is separated from the surface of the resin 13 and the resin 13 is removed, the substrate 10 having the bumps 16 formed on the plurality of electrodes can be obtained. |