| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_86dc9c9f208867a10f82d3b99e58a4b6 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D257-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07C257-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07C309-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07C309-47
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2004-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb1cd229801f012696098d7154009d82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_484e4ef0ff106dc04f6296a3febc09d8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af685c00d122ea12712c3b747918e3c9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_232a27d1153fa41895ea8a8450e0094f |
| publicationDate |
2007-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20070048211-A |
| titleOfInvention |
Copper plating additive and manufacturing method of electronic circuit board using same |
| abstract |
In the copper plating solution containing the copper plating additive which contains a specific nitrogen-containing biphenyl derivative as an active ingredient, the copper ion component and anion component which are added by this copper plating additive, and this copper plating liquid, the micropore thru | or microcircle of an electronic circuit wiring shape A manufacturing method on an electronic circuit board having a fine copper wiring circuit for electroplating an electronic circuit board having grooves formed on its surface as a cathode.n n n This copper plating additive can fill through-holes or via holes of micron to sub-micron level even when it is composed of one type of component, and the copper plating solution using the copper plating additive is extremely easy to manage liquid. The filling of the through hole and the via hole can be stabilized over a long time. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140013021-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018074883-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11214882-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210003286-A |
| priorityDate |
2004-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |