| abstract |
In a reflow apparatus using formic acid for cleaning a solder electrode surface, generation and scattering of reaction products due to the corrosive action of formic acid are prevented.n n n An apparatus for performing a reflow process on a solder member formed on a substrate to be processed includes a processing chamber and a formic acid introduction mechanism for introducing an atmospheric gas containing formic acid into the processing chamber, and the reflow processing unit and the processing chamber of the processing chamber. Between the inner wall, the shield material which consists of a member which has corrosion resistance with formic acid is arrange | positioned.n n n n Formic Acid, Corrosion Resistance, Shield Materials, Reflow Devices |