http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20070046874-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67109 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B7-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67098 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67051 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67155 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67017 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B3-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-677 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B7-04 |
| filingDate | 2005-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3611205ca0d7b85094d8707f585d0bed http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b1a9815764f9fc4e295759de4ef5c5e |
| publicationDate | 2007-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20070046874-A |
| titleOfInvention | Semiconductor substrate processing apparatus and method |
| abstract | According to one aspect of the invention, a semiconductor substrate processing apparatus and a semiconductor substrate processing method are provided. The semiconductor substrate processing apparatus includes a semiconductor substrate support, a dispensing head disposed above the semiconductor substrate support, a liquid container, and a transport auxiliary system. The semiconductor substrate will be located on the semiconductor substrate support, with the first semiconductor processing liquid dispensed thereon. The wafer is rotated by the semiconductor substrate support to remove the first semiconductor processing liquid. The transfer aid system will transfer the semiconductor substrate to the liquid container, where the semiconductor substrate will be immersed in the second semiconductor processing liquid. The semiconductor substrate is then removed from the second semiconductor processing liquid while the vapor is directed to the surface of the semiconductor substrate in contact with the surface of the second semiconductor processing liquid. |
| priorityDate | 2004-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.