http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20070043869-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f71ddd387b22b19ebcea454e62d66128 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-124 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-36 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate | 2005-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6240ee794d82f22ea975d10eca5cb493 |
| publicationDate | 2007-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20070043869-A |
| titleOfInvention | Solder Joint Flux |
| abstract | In order to improve the wettability, when an organic acid such as dicarboxylic acid is added to the solder joint flux, green metallic copper is generated by reaction with copper oxide. This copper metal soap is neither corrosive nor deteriorated in reliability, but is apparently identical to cyan, which is a symbol of corrosion, and is therefore indistinguishable. I need flux.n n n By adding tetrazole and tetrazole derivatives to the solder joint flux, it is possible to prevent unilateral reaction of only the carboxyl group and copper ions, thereby suppressing the generation of green metallic copper soap. In particular, among the tetrazole and tetrazole derivatives, 5-phenyl-1H-tetrazole and its derivatives having a phenyl group having a strong electron-absorbing property on the 1st position are hydrogen, and the derivative thereof become stronger in the solvent, It is good for solder joint.n n n Solder flux |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20120008900-A |
| priorityDate | 2004-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 73.