| abstract |
As a method for producing a high-precision probe sheet for narrow-pitch and high-density electrode pads with high integration of semiconductor chips, and for inspecting semiconductor chips, densified and narrowed to the same extent as electrode pads with pointed ends. By forming a large space area in which the terminal metal and the selectively removable metal film are arranged in advance in the terminal peripheral area of a fine contact terminal, the occurrence of damage in the inspection process can be greatly reduced, thereby minimizing and improving durability. do.n n n n Thin film probe sheet, probe card, semiconductor chip, inspection device, electrode pad |