http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20070029815-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ddcb273a108a5d8472b335280098e06 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-428 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-426 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12049 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0055 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2005-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c5ace09282c2f7c6b2d7f13fb027a91 |
| publicationDate | 2007-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20070029815-A |
| titleOfInvention | Method for manufacturing printed circuit board structures including via holes, electronic device unit, and use of flexible strip conductor film in the device unit |
| abstract | The present invention, among other things, can be implemented without the use of adhesives and produces printed circuit board structures having the smallest possible via holes having a diameter that is flexible, for example in the range of 1 to 5 μm. It relates to a method for doing so. The method is based on the use of support means for a printed circuit board structure that does not yet have any copper cladding. To obtain the minimum via holes, through holes are bumped or laser treated with the only provided support material by heavy ions or precision laser. Thereafter, the surfaces of the support means are copper clad. At the same time, electrical via holes are created. If the support means is for example soft polyimide and has not yet been pretreated for copper cladding, the surface of the support means may be roughened by correspondingly controlling the acceleration intensity or the precision laser intensity of the heavy ions as the holes are inserted. The desired printed circuit board structure is then completed in accordance with conventional methods. The invention also relates to an electronic device unit and the use of a flexible strip conductor film in the electronic device unit. Flexible strip conductors having at least one film via holes are used, wherein the film via holes are formed from film passages, which are original passageways created by bumping with heavy ions. |
| priorityDate | 2004-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 |
Total number of triples: 28.