| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2379-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-16 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-281 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 |
| filingDate |
2005-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2007-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20070021672-A |
| titleOfInvention |
Polyimide Film and Copper Clad Laminates Using the Same |
| abstract |
The present invention relates to a polyimide film and a copper clad laminate using the same.n n n The polyimide film according to the present invention is excellent in chemical resistance, in particular alkali resistance, and has no properties without deterioration in mechanical properties or bending properties without the use of a separate inorganic filler. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102374543-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102374542-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102374540-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101404093-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101493595-B1 |
| priorityDate |
2005-08-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |