| abstract |
An object of this invention is to provide the manufacturing method of an electronic device for manufacturing the electronic device which was excellent in reliability, and the electronic device manufactured by the said manufacturing method.n n n The integrated circuit 1 has a two-layer bonding pad 8 that is connected through a conductive wiring 5 and a contact hole 10, and the bonding pad 8 is a bonding wire 8. A surface layer 7 bonded to the bonding wire 9 and a base layer 6 for enhancing the adhesion between the surface layer and the coating layer 4 are provided. The base layer 6 and the surface layer 7 are formed by the droplet discharging method, and Ni and Au capable of liquidification under conditions suitable for use in the droplet discharging method are used as materials. |