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filingDate 2006-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc2decc79f26a448461c878478d4995d
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publicationDate 2007-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20070003626-A
titleOfInvention Heat dissipation member and its manufacturing method
abstract The present invention provides a heat dissipation member (10, 20) comprising a thermal diffusion sheet (1) and a thermally conductive polymer layer (2) laminated on at least a portion thereof. The thermal conductivity in the thickness direction of the thermally conductive polymer layer 2 is higher than the thermal conductivity in the direction parallel to the surface of the thermally conductive polymer layer 2. The heat dissipation members 10 and 20 are formed by laminating independently formed thermally conductive layers 2 including thermally conductive fillers 3 and 4 on at least part of the thermal diffusion sheet 1. The thermally conductive fillers 3 and 4 are oriented in a constant direction. Alternatively, the heat dissipation members 10 and 20 laminate the thermally conductive polymer composition containing the thermally conductive fillers 3 and 4 onto the thermal diffusion sheet 1; Orient the thermally conductive fillers 3 and 4 in a constant direction; It is formed by curing the thermally conductive polymer composition while maintaining the orientation.n n n n Heat dissipation member, thermal diffusion sheet, thermal conductive polymer layer
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140089725-A
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priorityDate 2005-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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