| abstract |
On the substrate on which the conductor layer 5 is provided, a pad 16 for fixing the conductive connecting pins is formed on the package substrate 310 on which the conductive connecting pins 100 for making electrical connection with the motherboard are fixed. By covering the pad 16 with the organic resin insulating layer 15 having the openings 18 partially exposed, and fixing the conductive connecting pins 100 via the conductive adhesive 17 to the pads exposed from the openings. In the case of mounting or the like, the conductive adhesive pin 100 is hardly peeled off from the substrate. |