| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-05 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J171-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J171-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00 |
| filingDate |
2004-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c01ff7d1f702d2f10a53ca35590a6081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f282fc65a063276a10c1793c4efcc81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb2be707f5cc72d29cabf3165f0ac1a4 |
| publicationDate |
2006-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20060126674-A |
| titleOfInvention |
Hot Melt Adhesive Composition |
| abstract |
INDUSTRIAL APPLICABILITY The present invention is an adhesive composition for immobilizing a semiconductor wafer or the like on a supporting substrate. The adhesive composition has a strong and high heat resistance at the time of the grinding process, and can be easily peeled off by heating and melting after the kind of the grinding process. to provide.n n n The hot melt adhesive composition of the present invention is a composition comprising a crystalline compound having a melting temperature of 50 to 300 ° C. as a main component, and has a melting temperature width of 30 ° C. or less and a melt viscosity of 0.1 Pa · s or less. . The crystalline compound as the main component is preferably an organic compound having a molecular weight of 1,000 or less, preferably an aliphatic compound or an alicyclic compound, and particularly preferably a steroid skeleton and / or a hydroxyl group-containing compound, which are composed of only C, H, and O elements. |
| priorityDate |
2003-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |