http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20060125883-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c21b043cc1c380a31e231a24aa7a8aea |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31504 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-3154 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-095 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate | 2005-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab5ec932f74fe0b122ad1447920c61d1 |
| publicationDate | 2006-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20060125883-A |
| titleOfInvention | Adhesive Bond and Manufacturing Method Thereof |
| abstract | The present invention relates to an adhesive bond of a substrate material (1) containing other material (4), and more particularly, the surface of the substrate material and the solid region near the surface is a polymer compound having a low active surface energy It is related with the said adhesive bond containing. The invention also relates to a method for producing a corresponding adhesive bond. In particular, the present invention is directed to adhesively metallized, such as polytetrafluoroethylene (PTFE) as a base material for printed circuit boards (precision and ultra-precision printed circuit boards) with very high structural density for use in the GHz region. It relates to a fluoropolymer and to a method for adhesive metallization of a corresponding fluoropolymer. In accordance with the invention the adhesive bond is formed by a transition region 6 which is nanostructured and contains a nanocomposite between the substrate material 1 and the other material 4, within which the substrate material 1 Nanostructured and transferred to other materials (4). The nanocomposite is composed of the substrate material (1) and other materials (4), the material component of the nanocomposite changes in the direction of the substrate material (1) from the other material (4), that is, most of the substrate material ( It starts from the component 1) and transfers to the component which is the other material (4). In this regard, the nano-fractured surface of the substrate material 1 is physically and / or chemically excited, and while the excited state is maintained, the other material 4 is With the other material 4 being applied in the form of particles until the complete coating layer is formed on the surface of the substrate material 1, an adhesive bond according to the invention is produced. |
| priorityDate | 2004-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23675242 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID454511054 |
Total number of triples: 27.