| abstract |
Not only can a molded article having excellent mechanical properties, dimensional stability and heat resistance be provided, but also a thermosetting resin composition which can maintain a shape extruded before curing well after curing. A thermosetting resin composition comprising 100 parts by weight of a thermosetting resin and 1 to 100 parts by weight of an inorganic compound dispersed in the thermosetting resin, wherein a dispersion particle diameter of the inorganic compound is 2 μm or less, and a shape shaped before curing is maintained at 75% or more after curing. And the board | substrate material and board | substrate film comprised using the said thermosetting resin composition.n n n n Thermosetting resin composition, substrate material, substrate film, inorganic compound, layered silicate |